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Polyimide 25µm FPC Flexible PCB
PCB Material:Polyimide 25µm / 0.24mm
MOQ:1PCS
Price:7.99-49 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-12 working days
Payment Method:T/T, Paypal
 

Polyimide 25µm FPC – 2-Layer 0.24mm Thick Flexible PCB with Immersion Gold for High-Frequency Applications


1.Revolutionize Your Flexible PCB Designs with Polyimide 25µm FPC

Polyimide 25µm FPC is a high-performance flexible printed circuit board designed for high-frequency signal transmission and dynamic bending scenarios. With a dielectric constant (Dk) of 3.3 and a dissipation factor (Df) of 0.0019 at 10 GHz, this 2-layer flexible PCB is perfect for mobile phones, wearable devices, automotive electronics, and medical devices.


Featuring immersion gold surface finish, excellent flexibility, and superior thermal resistance, this FPC ensures reliable performance in harsh environments, making it the ideal choice for high-reliability flexible electronic devices.


2.Key Features of Polyimide 25µm FPC

Dielectric Constant (Dk): 3.3 at 10 GHz
Dissipation Factor (Df): 0.0019 at 10 GHz
Peel Strength: ≥1 N/mm
Moisture Absorption: ≤1.5%
Halogen-Free & Flame Retardant: Meets UL94 V-0 standards
Excellent Flexibility & Thermal Resistance: Ideal for dynamic bending and high-temperature environments.


3.Product Advantages

High Frequency and Flexibility:Break through the high-frequency performance bottleneck of traditional FPCs, supporting millimeter-wave and high-speed data transmission.
Extraordinary Long Lifespan:The dynamic bending performance is superior to industry standards, ensuring the reliability of folding devices.
Resistant to Harsh Environments:Passed a number of reliability tests such as high-temperature and high-humidity (double 85), and thermal shock (-40°C to 125°C).
Cost Optimization:It has a higher cost-performance ratio compared to similar imported products (such as DuPont Pyralux AP), and the local supply chain offers a rapid response.


4.PCB Stackup: 2-layer flexible PCB

SpecificationDetails
Copper Layer 135 μm
Adhesive20 μm
SF305 Polyimide Core0.025 mm (25 μm)
Adhesive20 μm
Copper Layer 235 μm

5.PCB Construction details:

ParameterSpecification
Board Dimensions75mm x 62mm = 1PCS, ±0.15mm
Minimum Trace/Space14/16 mils
Minimum Hole Size0.5mm
Blind ViasNo
Finished Board Thickness0.24mm
Finished Cu Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishElectroless Nickel Immersion Gold (ENIG)
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskYellow
Bottom Solder MaskYellow
Electrical Test100% tested prior to shipment

6.PCB Statistics:

Components: 2
Total Pads: 14
Thru Hole Pads: 12
Top SMT Pads: 2
Bottom SMT Pads: 0
Vias: 0
Nets: 2


7.Accepted Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping


8.Applications of Polyimide 25µm FPC

Computer
Mobile phone
Digital camera, VCR
Automobile, Office Automatic equipment, etc.


Polyimide 25um FPC 2-layer 0.24mm Thick Immersion Gold


9.Upgrade Your Flexible PCB Designs with Polyimide 25µm FPC!

Whether you're working on foldable smartphones, wearable tech, or automotive electronics, Polyimide 25µm FPC offers the perfect combination of flexibility, reliability, and high-frequency performance. With low dielectric loss, excellent bending resistance, and immersion gold finish, this FPC is the ideal choice for your next flexible PCB project.


 

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